bulletin # 1412112 _____________________________________________________________________________________________________ w7206f 2 silicon labs bulletin rev j the information contained in this document is proprietary to silicon laboratories, inc. and shall not be reproduced or used in part or whole without silicon laboratories written consent. the document is uncontrolled if printed or ele ctronically saved. pg 3 user registration register today to create your account on silabs.com. your personalized profile allows you to receive technical document updates, new product announcements, how - to and design documents, product change notices (pcn) and other valuable content available only to registered users . http://www.silabs.com/profile bulletin date: 12/11/2014 bulletin effective date: 12/11/2014 title: efm32gg900 datasheet revision notification originator: ted batey phone: 512 - 532 - 5279 dept: marketing customer contact: kathy haggar phone: 512 - 532 - 5261 dept: sales bulletin details description: silicon labs is pleased to announce v ersion 1.1 of the efm32gg 9 00 giant gecko wafer sale datasheet is now available. this revision updates section 3.4 bonding instructions with a recommendation to use gold bond wires. an environmental section (3.5.1) has also been added which discusses potential bare die sensitivity to ambient light. reason: this bulletin recommends that customers purchasing wafers and designing their own packages use gold bond wires. customers using bare die also need to be aware of potential light sensitivity. product identification: efm32gg900f512g - d - d1i efm32gg900f1024g - d - d1i this change is considered a minor change which does not affect form, fit, function, quality, or reliability. the information is being provided as a customer courtesy. please contact your local silicon lab s sales representative with any questions about this not ification . a list of silicon labs sales representatives may be found at www.silabs.com customer actions needed: review packaging and bonding design to ensure use of gold bond wires.
|
